THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	TSENG, HH	en_US
dc.contributor.author	WU, CY	en_US
dc.date.accessioned	2014-12-08T15:06:01Z	-
dc.date.available	2014-12-08T15:06:01Z	-
dc.date.issued	1988-01-01	en_US
dc.identifier.issn	0038-1101	en_US
dc.identifier.uri	http://hdl.handle.net/11536/4578	-
dc.language.iso	en_US	en_US
dc.title	THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS	en_US
dc.type	Article	en_US
dc.identifier.journal	SOLID-STATE ELECTRONICS	en_US
dc.citation.volume	31	en_US
dc.citation.issue	1	en_US
dc.citation.spage	35	en_US
dc.citation.epage	44	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	工學院	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.contributor.department	College of Engineering	en_US
dc.identifier.wosnumber	WOS:A1988L593300006	-
dc.citation.woscount	7	-
顯示於類別：	期刊論文

APA	TSENG, H., & WU, C. (1988). THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS. WOS:A1988L593300006.
Bibtex	@article{TSENG1988THE, title={THE EFFECTS OF THERMAL SILICIDATION ON THE CURRENT TRANSPORT CHARACTERISTICS OF TI/(111)SI SCHOTTKY-BARRIER CONTACTS}, author={TSENG, HH and WU, CY}, journal={WOS:A1988L593300006}, year={1988}, url={https://ir.lib.nycu.edu.tw/handle/11536/4578?mode=full}, }