利用實驗設計法改善測試機台造成 IC 晶粒破裂之問題---以A封測廠為例

Abstract

記憶卡已成為目前保存資料、圖片等重要的電子產品。雖然現今半導體業對於記憶卡產品的製造流程及技術已趨於穩定成熟，但在製造過程中，仍有可能發生異常情況。本研究的個案公司為一半導體的封測廠（稱為A封測廠），其記憶卡產品的客戶，A封測廠所交付的產品中，有部份記憶卡無法讀取的現象。A封測廠發現造成記憶卡無法讀取的原因主要在於積體電路（Integrated Circuits, IC）晶粒（Die）破裂的問題，但檢視其生產過程，並無發現任何異常的狀況。在排除多項可能造成異常的原因後，A封測廠認為問題可能肇因於測試機台。 為協助A封測廠釐清造成異常的原因，本研究利用實驗設計法，找出其相關因子，並利用統計軟體，運算出變異數分析表，找出測試機台造成晶粒破裂的主要原因，並加以改善。從執行改善後的結果研判，確認實驗設計法找出之主要因子，為造成機台晶粒破裂的主要原因。盼此一研究成果，可作為其它公司預防類似機台異常的發生。

Memory card has become the most important electronic product for preserve data, images and documents. The manufacturing procedure and technique of memory card have being developed and stable in nowadays semi-conduct industry. However, unpredictable abnormality might happen at manufacturing line. In this study case, we focus on an assembly and testing semiconductor factory, which we name it “A” customer found out that part of memory cards cannot be read, which was delivered by A assembly & testing factory. After researched, the main reason of un-readable memory card was cause by Die crack of IC（Integrated Circuits）. However, no abnormality was being found in production procedure. They examined several possible causes and eliminated them one by one. In the end, they suspect the possible root cause might come from the testing machine. Assisting with A factory to clarify the root cause, we utilized Design of Experiment to search out the related factors. Furthermore, we figure out the ANOVA through software calculator, and validate the main defect mode of testing machine, then improve it. As a result of implemented actions, we confirmed that the main factor comes out from DOE is truly the root cause for die crack. We wish that this research could be useful to other company to prevent from similar machine abnormality.