标题: 变压耦合式电浆制程设备之先进设备控制
Advanced Equipment Control in Transformer Coupled Plasma Processing Equipment
作者: 张朝雯
Chao-wen Chang
林家瑞
Chia-shui Lin
机械工程学系
关键字: 电浆;变压耦合式电浆源;区域平均模式模型;顺滑模态;反应曲面法;plasma;TCP;global model;sliding mode;response surface method
公开日期: 2003
摘要: 电浆因其在材料处理上的特殊性质,故在半导体制程中广泛的被应用。然而虽然电浆有许多应用上的优点,却也因为复杂的反应机制会造成蚀刻结构的变化与伤害,因此如何达到元件性能的需求,先进制程(设备)控制的引进成为一项重要的课题。而物理化学模型的建立成为描述设备参数与制程参数间重要的关键,本项研究将电浆蚀刻制程分为设备模型与制程模型两段,先架构电浆蚀刻设备模型,并以区域平均模式模型来描述设备输入参数与电浆制程参数间之关系,再与实验结果及文献相互印证。而控制部分则针对电浆成分中之关键参数‘电子密度’做监控,因为在电浆反应中,主要的能量吸收、反应机制大多由电子来传递,故电子的行为可以用来掌控电浆之状况。控制器设计分为动态模型控制器设计、稳态模型控制器设计两种。动态模型采用顺滑模态的设计方式,设计单一输入(电浆吸收功率)单一输出(电子密度)之控制器来控制电浆设备,不受环境扰动及系统参数变动的影响;稳态模型则以反应曲面法的概念设计控制器,模拟数据显示控制器皆能对外界干扰源做补偿,将系统维持在设定的目标值上,以提供制程一稳定的环境。
Plasma is widely used in semiconductor processing because of its special property for material processing. Although there are many advantages for application, some problems of structure variation and damage are caused by complex physical and chemical reaction. Therefore, real-time Advanced Process (Equipment) Control is a major area of research and development in improving the desired device performance. Using physical and chemical model is the key approach to describe relationship between equipment parameters and processing parameters. In this thesis, modeling the plasma etching process consists of equipment model and processing model. The first objective is to focus on equipment model by Spatial Averaged Model to explain relationship between input equipment parameters and output plasma parameters in Transformer Coupled Plasma system and confirm the model from experiment data. The second objective of this thesis is to design a controller in order to control electron density. The most important factor of sustaining the glow discharge in plasma is electron behavior
which impacts ionization and power absorption in plasma processing tool. There are two types of controller to achieve controller design goal:dynamic model approach and
steady state model approach. The sliding mode controller controls the plasma processing equipment and rejects disturbance and parameter variation using single input (plasma absorption power) single output (electron density) in dynamic model approach. Steady state model approach uses response surface method (RSM) which is based on experiment data or theoretical model. Theoretical model is used in this thesis for controller design. Simulation results show that both types of controller can compensate disturbance effect and parameter change and improve performance of plasma equipment.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT009114595
http://hdl.handle.net/11536/48235
显示于类别:Thesis


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