標題: NUMANA - 結合數值法與解析法的三維度積體電路熱分析技術
NUMANA-A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs
作者: 吳宗恆
Wu, Tsung-Heng
李育民
Lee,Yu-Min
電信工程研究所
關鍵字: 熱分析;三維度積體電路;Thermal simulation;3-D IC
公開日期: 2012
摘要: 藉由結合數值法與解析法的分析技術,本篇論文發展出一套熱分析技術NUMANA,可以處理複雜的材質與結構,並有效率地分析三維度積體電路的溫度分佈。根據材質分佈的複雜程度,可以選擇使用單點展開或多點展開遞迴式解析法,以減少近似項數達到有效率地分析。與一套能夠快速解對稱正定矩陣的軟體 SuperLU 4.3版比較,所有實驗中 NUMANA的最大誤差在 2.2% 以下,而分析速率加倍15倍以上。此外,為了展示分析效率,以含有一百六十萬節點數的三維度積體電路等效熱模組為例,NUMANA 不但精準地得到溫度分佈,比之 SuperLU 也加速了850倍。
By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a three-dimensional integrated circuit (3-D IC). In different complexity of material distribution, NUMANA can execute single point expansion or multi-point expansions recursive analytical based simulation to reduce truncation order and achieve efficient simulation. Compared with a fast SPD (symmetric positive definite) matrix solver, SuperLU_v4.3, the maximum error of NUMANA for all test cases is under 2.2%, and its speedup is over 15 times. Furthermore, to demonstrate its efficiency, given an equivalent thermal model of 3-D IC with control volumes of 1.6 million, NUMANA not only can accurately estimate its temperature profile, but also can achieve 850 times speedup over SuperLU.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT079913553
http://hdl.handle.net/11536/49332
Appears in Collections:Thesis