標題: | NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs |
作者: | Lee, Yu-Min Wu, Tsung-Heng Huang, Pei-Yu Yang, Chi-Ping 交大名義發表 National Chiao Tung University |
公開日期: | 1-一月-2013 |
摘要: | By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup. |
URI: | http://hdl.handle.net/11536/146840 |
ISSN: | 1530-1591 |
期刊: | DESIGN, AUTOMATION & TEST IN EUROPE |
起始頁: | 1379 |
結束頁: | 1384 |
顯示於類別: | 會議論文 |