NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Lee, Yu-Min	en_US
dc.contributor.author	Wu, Tsung-Heng	en_US
dc.contributor.author	Huang, Pei-Yu	en_US
dc.contributor.author	Yang, Chi-Ping	en_US
dc.date.accessioned	2018-08-21T05:56:55Z	-
dc.date.available	2018-08-21T05:56:55Z	-
dc.date.issued	2013-01-01	en_US
dc.identifier.issn	1530-1591	en_US
dc.identifier.uri	http://hdl.handle.net/11536/146840	-
dc.description.abstract	By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.	en_US
dc.language.iso	en_US	en_US
dc.title	NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	DESIGN, AUTOMATION & TEST IN EUROPE	en_US
dc.citation.spage	1379	en_US
dc.citation.epage	1384	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.identifier.wosnumber	WOS:000415129400267	en_US
顯示於類別：	會議論文