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dc.contributor.authorWong, SCen_US
dc.contributor.authorPan, KHen_US
dc.contributor.authorMa, DJen_US
dc.date.accessioned2014-12-08T15:01:44Z-
dc.date.available2014-12-08T15:01:44Z-
dc.date.issued1997-06-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.585349en_US
dc.identifier.urihttp://hdl.handle.net/11536/517-
dc.description.abstractIn this letter, a novel single-pair mismatch model for short-channel MOS devices is developed, and scaling effects of mismatch distributions are investigated based on the model, Mismatch effect is modeled with threshold voltage, current factor, source resistance, and body factor mismatches, SPICE mismatch simulation is defined with mismatch parameters extracted from the model for accurate offset estimation in circuit simulation. Scaling effects with device size are investigated based on statistical mismatch data, and the results indicate that CMOS mismatch is induced by both local edge roughness and global variations, In addition, a root n-law model is developed for modeling gate-finger dependence of mismatch.en_US
dc.language.isoen_USen_US
dc.titleA CMOS mismatch model and scaling effectsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.585349en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume18en_US
dc.citation.issue6en_US
dc.citation.spage261en_US
dc.citation.epage263en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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