冷卻速率對銲錫凸塊之微硬度和接觸電阻的影響及無電鍍鎳對鋁墊打線接合的影響

標題:	冷卻速率對銲錫凸塊之微硬度和接觸電阻的影響及無電鍍鎳對鋁墊打線接合的影響 Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads
作者:	鄭仁鈞邱碧秀電子研究所
公開日期:	1984
URI:	http://140.113.39.130/cdrfb3/record/nctu/#NT732428007 http://hdl.handle.net/11536/52026
Appears in Collections:	Thesis