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dc.contributor.authorTrappey, C. V.en_US
dc.contributor.authorTrappey, A. J. C.en_US
dc.contributor.authorLin, F. T. L.en_US
dc.date.accessioned2014-12-08T15:07:24Z-
dc.date.available2014-12-08T15:07:24Z-
dc.date.issued2007en_US
dc.identifier.issn0951-192Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/5835-
dc.identifier.urihttp://dx.doi.org/10.1080/09511920601160122en_US
dc.description.abstractThe integration of IC design and manufacturing (IDM) is a major trend in the modern management paradigm of the semiconductor supply chain. In order to shorten the time-to-market for complex system-on-chips (SoC), the trade and reuse of silicon intellectual properties (SIPs) for fast IC design becomes a critical success factor for semiconductor IDM. In this research, intelligent mobile agents and fuzzy evaluation models are built into a knowledge services and trade platform (KSTP). The mobile agent behaviour model is used for knowledge acquisition and negotiations between sites of SIP providers, buyers and intermediators. The agent- based KSTP considers time, cost and precision of acquiring SIP information needed for SoC design and fabrication. For trade partner matching, fuzzy evaluation models are developed to consistently suggest suitable partners for trades under di. erent circumstances. The ultimate goal of the research is to enable autonomous, dynamic and collaborative SIP exchanges and trades in the global value chain of semiconductor industry.en_US
dc.language.isoen_USen_US
dc.subjectsilicon intellectual property (SIP)en_US
dc.subjectsystem on chip (SoC)en_US
dc.subjectknowledge servicesen_US
dc.subjectE-tradeen_US
dc.subjectmobile agenten_US
dc.titleDeveloping silicon intellectual property E-trade mechanisms for system on chip design and integrationen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1080/09511920601160122en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF COMPUTER INTEGRATED MANUFACTURINGen_US
dc.citation.volume20en_US
dc.citation.issue5en_US
dc.citation.spage423en_US
dc.citation.epage435en_US
dc.contributor.department管理科學系zh_TW
dc.contributor.departmentDepartment of Management Scienceen_US
dc.identifier.wosnumberWOS:000248333700003-
Appears in Collections:Conferences Paper


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