電漿表面處理對鋁膜在聚亞醯胺上黏著性質提升之研究

Abstract

在多晶片模組(Multichip Module , MCM)構裝使用的多層聯線基板 中，介電絕緣層與導體金屬層界面之間的黏著強度，因關係著其結構的可 靠度□而顯得格外重要。兩種材料間的黏著強度主要取決於界面的表面形 貌及化學反應，既往的研究顯示鋁膜與聚亞醯之間的黏著性質易受環境因 素影響而劣化，因電漿表面處理可提供化學與機械整修的功能□為提高界 面接合性質的有效方法之一，故進行此一研究。本實驗改變電漿處理的時 間、能量及流量以對聚亞醯胺表面進行處理，並配合原子力顯微鏡( Atomic Force Microscopy, AFM)進行表面形貌觀察，以探討此一處理對 高分子表面形貌的影響。90度剝離試驗同時被用以測量鋁膜在經電漿表面 處理後之聚亞醯胺上之黏著強度變化，以探討表面形貌變化對界面接合強 度的影響。實驗結果顯示固定電漿表面處理的能量及流量時，隨著處理的 時間加長，可使界面黏著強度提升一倍以上，但處理的時間過長則會對聚 亞醯胺形成過度處理，雖然粗糙度會增加，但對界面接合強度之提升以無 助益。改變電漿處理的能量時，結果跟改變時間類似，至於氣體流量的改 變則對接合強度對接合強度之提升則無明顯之增益。 Ployimide (PI) is very popular dielectric materialfor multilayer interconnection substrate fabrication of MCM packaging. The Adhesion of conduction metals to the PI becomes an important issue, as it determines the reliablity and performanceof the interconnecting circuitry of the substrate. The adhesion of metal/PI interface depends on the morphological and chemical properties of the interface. Since plasma surface treatment is able to offer both morphological and chemical modification of interface, we hence studied the effect of such a treatment on the adhesion enhancement of Al film on PI. Atomic force microscopy (AFM) was used to investigate the morphological and roughness change of PI surface after plasma treatment. The adhesion strength of Al film on plasma-treatedPI was evaluated by a 90anger-peel test. The experimental results indicated that surface roughness of PI increased as the timeand power of plasma treatment increased. The peel strength increased accordingly, then decreased as the time and power of treatmentfuther increased. In addition, no singificant improment of peel strength was observed when the gas flow of plasma treatmeant was increased.