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dc.contributor.author連南鈞en_US
dc.contributor.authorLian, Nan-Chiunen_US
dc.contributor.author蘇翔en_US
dc.contributor.authorSu Shyangen_US
dc.date.accessioned2014-12-12T02:17:32Z-
dc.date.available2014-12-12T02:17:32Z-
dc.date.issued1996en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#NT850428111en_US
dc.identifier.urihttp://hdl.handle.net/11536/61985-
dc.description.abstract本文主旨在X光微影技術中所需要X光光罩上圖形成形的研究,選擇的是以 鎢為X光吸收劑的材料.為了避免吸收劑在蝕刻過程中因薄膜應力過大而造 成圖案的扭曲或形變,我們歸納出最適合的濺鍍條件,使吸收劑具有很小之 應力變化. 在適當的蝕刻氣體混合比例與間歇操作條件下,也成功地蝕刻 出0.3微米 垂直側壁吸收劑的線寬. 最後,我們也在吸收劑上,針對更小線 寬的圖案,利用 電子束直寫之微影技術來討論近距效應之情形. It is the purpose of this thesis to develop the absorber patterning ofx-ray mask required in x-ray lithography. The tungsten film is adopted as absorbers. The satisfactory recipes for sputtering low-stress absorber were obtained to avoid distortion during the etching process. The 0.3 umpatterns were etched sucessfully with vertical sidewall by proper etchantproportions mixture intermittent process. Finally, we discuss the proximityeffect on the absorbers for fine line patterning in electron beam direct write lithography.zh_TW
dc.language.isozh_TWen_US
dc.subjectX光zh_TW
dc.subjectX光光罩zh_TW
dc.subject蝕刻zh_TW
dc.subject電子束zh_TW
dc.subject電子束曝光zh_TW
dc.subject吸收劑zh_TW
dc.subjectX-rayen_US
dc.subjectX-ray masken_US
dc.subjectetchen_US
dc.subjecte-beamen_US
dc.subjecte-beam lithographyen_US
dc.subjectabsorberen_US
dc.titleX光光罩圖形製作之研究zh_TW
dc.titleA Study on the Patterning of X-ray Masken_US
dc.typeThesisen_US
dc.contributor.department電子研究所zh_TW
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