熱輻射元件之真空封裝技術的研究

Abstract

熱輻射元件(bolometer)是利用溫度感測元之薄膜電阻,以為輻射熱之 感測.其熱靈敏度(thermal responsivity)與元件熱導成反比.利用理論做 元件之熱導模擬分析可知,在一大氣壓下,其氣體熱導遠大於固體熱導,故 此時元件熱導由氣體熱導主導之.因此,為降低元件之熱導值以增大對紅外 線的靈敏度,必須有真空封裝之結構.本實驗所提之真空封裝技術是藉由銦 錫合金焊料所具有之低熔點特性,配合真空膠在真空烘烤,將元件封於真空 環境中,以達降低熱輻射元件熱導值之目的. It uses the thin-film resistor on the sensor for the detection of radiation bymicrobolometer.Its thermal sensitivity is inversely proportional to the thermalconductance of the device.We know that the gas conductance is much greater thanthe solid conductance at i a.t.m. from the numerical calculationof the Theory.Sothe thermal conductance of the device is dominated by the gas conductance at that condition.Therefore,it needs to develop the technique of vacuum package in order toincrease the sensitivity of IR by lowering the thermal conductance of the device.In the thesis,the vacuum package technique we construct combines the low-melting-pointIn-Sn solder with epoxy potting resin in vacuum,and seals the device in vacuum atmophere in order to lowering the thermal conductance of bolometer.