微波陶瓷低溫燒結及介電性質研究

Abstract

高頻介電元件的多層及微小型化可增加其體積效率，且在多層介電元件製作中，必須降低燒結溫度才能與低損失的導體如金和銀等共燒，而隨著無線行動通訊系統快速地成長，體積小、重量輕的手機在商業化強烈競爭需求下，成為發展的必然趨勢，因此可低溫燒成微波高介電材料的開發即是一個重要的課題。 在本研究中，首先對含稀土族Re元素(La, Nd, Sm)的三元陶瓷系統統Ba0-Re03-Ti02作高溫燒結塊材研究，一方面分析900-1300℃鍛燒粉末的微觀結構及生成相的變化，一方面研究塊材的微波特性，選用Bao-Nd2O3-4TiO2微波高介電陶瓷系統〔1300℃燒結1小時，εr=67, Q=1138 (3 GHz), τf=+24ppm/℃〕作為陶瓷主體，並添加低熔點(655℃)的商用玻璃GP032 (Zn0-B2O3-SiO2)作低溫燒結塊材和基板的研究。首先製作不同的玻璃添加量(5-20vol%)於900-1000℃燒結成玻陶瓷塊材，對塊材的燒結及微波特性作比較。以玻添加量15vol%的陶瓷塊材〔100℃燒結4小時，εr=42, Q=648 (3 GHz)〕作為陶瓷基板的玻璃陶瓷體的添加依據，以水作為溶濟，加入適當比例的黏結劑HEC、塑化劑Glycerin，形成水系漿料以刮刀法薄帶成形，再將薄帶生胚以四層疊壓後，以1000℃燒結製成緻密薄片，密度為4.99g/cm3，略小於Ba0-Nd2O3-4TiO2高溫燒結塊材的密度5.22g/cm3。

Multi-layers and miniaturization of High frequency dielectiric devices can improve volume effects. Lower sintering temeperature can be co-fired with conductors. like Au, Ag and so on having low dielectric loss. Due to the rapid growth of communications industry using microwave frequencies, cellular phones with small volume and light weight become necessary trend. In this study, first, we fabricate high-temp. sintering bulks of BaO-Re2O3-TiO2 (Re=La, Nd, Sm) ternary systems, after analyzing calcined powders (T=900-1300℃) microstructures and phase transitions. These bulks' microwave properties have been measured. BaO-Nd2O3-4TiO2 system owning needed mecrowave properites., which εr=67, Q=1138 (3 Ghz), τf=+24ppm/℃ (1300℃ sinter 1hr) is the favorite ceramic system for low-temp.sintering fabrications. Microwave properties of ceramic bulks containing different components (5-20vol%) commercial glasses GP032 (ZnO-B2O3-SiO2) sintering at low temperature (900-1000℃) have also been studied. Based on dense bulks with 15vol% GP032 addition, which εr=42, Q=648 (3 GHz) (1000℃ sinter 4hr) and adding proper binder (HEC) and plasticizer (Glycerin) the apueous slurry was formed to be slips using doctor tape casting method. The sinitered substrates, whose green tape contains 4 pressed layer, have density, 4.99g/cm3 lower than high-temp.sintered bulks (5.22g/cm3).