金屬氧化物對高分子與銅介面的影響之研究

Abstract

本論文研究的目的在於探討銅表面上各種不同的處理方式，對銅與環氧樹脂接著時，其接著性質及可靠度所產生的影響；本研究所選的表面處理劑共有五種：矽烷偶合劑N-β(aminoethyl)γ-aminopropyl methyl dimethyl dimethoxy silane (Silane)、鈦系偶合劑 ethonal,2,2',2'- itritotils - titanium (4+) salt (TE)、 tetraisopropyl titanate (TPT) 、矽溶膠Silica Sol及 ALG等。 此研究以反射式紅外線光譜（RAIR）來分析不同表面處理方式，對環氧樹脂之熱劣化所造成的影響；以及利用X射線能量散佈分析儀（EDS）觀察銅離子擴散的情形，探討銅離子擴散與環氧樹脂劣化的關係。並且藉由剝離強度試驗及掃描式電子顯微鏡實驗，來討論不同表面處理方式，對銅與環氧樹脂接著性質的影響。 綜合以上的實驗結果，本研究所選用的這五種表面處理劑，均能抑制銅離子的擴散，以減緩環氧樹脂的劣化，不同種類和不同濃度的表面處理劑，各有不同程度抑制的效用。其效果依序為ALG＞Silica Sol＞TPT＞Silane＞TE；老化75hr後，處理劑對剝離強度之保持能力以0.5﹪ALG (84﹪)最佳，1﹪TE（69%），0.5﹪Silica Sol （63﹪）；整體上ALG和Silica Sol似乎是理想之處理劑。

By investigating the pretreatment condition of copper plates with N-β(aminoethyl)γ-aminopropyl methyl dimethyl dimethoxy silane (Silane), ethonal,2,2',2'-nitritotils-titanium(4+) salt (TE), tetraisopropyl titanate (TPT) ,Silica Sol, and ALG, we have demostrated that the deposition have a significant effect on the adhesion and the durability of copper/epoxy joints. Reflection absorption infrared spectroscopy (RAIR) has been used to investigate the effect of different pretreatment on the thermo-oxidative degradation of epoxy system. The diffusion of copper ion was studied by using energy dispersive X-ray spectrometer (EDS). A lab shear strength test and the scanning electron microscope (SEM) were used to investigate the adhesion of the copper/epoxy joints. It is concluded that all of these pretreatment agents have the nature to improve the degradation of epoxy because the decrease of copper ion diffusion. In general, the ALG and Silica Sol seem to be the better pretreatment agents.