集束型半導體製程設備之可靠度分析

Abstract

本文旨在研究集束型半導體製程設備的可靠度。半導體製程設備屬於大型機電整合系統，可靠度的複雜性比生產一個產品的可靠度來得不易分析，除了考慮各元件本身的可靠度之外，還須知道各個元件間的關連及其彼此物理連結。本文首先介紹集束型設備的硬體，然後介紹可靠度一些方法，如方塊圖分析、樹狀圖形分析，將整體系統內元件彼此的關係用圖示表現，進而藉表示出來的關係計算可靠度，最後在可靠度的考量下探討產能方面的表現。

This study is focused on the reliability of cluster tools in semiconductor production equipment. Cluster tools in semiconductor production equipment belong to a large-scale mechatronic system, which is not amenable to reliability analysis. One has to take into account the correlation and physical interconnection among components in addition to the reliability of each component itself. This work introduces the hardware of cluster tools for semiconductor production equipment first, and then describes methods such as the block diagram analysis and Bryant tree analysis. By using these methods, this work relates components in the whole system using graphs. Reliability is calculated by matrix manipulation. Finally, based on the cluster tool reliability, this study investigates the throughput of cluster tools in semiconductor production equipment.