标题: | 整合晶圆制造与针测流程之生产规划系统建构 The Construction of Production Planning System for Integrating Wafer Fabrication and Probing Process |
作者: | 李琼瑛 Chiung-Ying Lee 钟淑馨 Dr. Shu-Hsing Chung 工业工程与管理学系 |
关键字: | 多厂规划;晶圆针测;制程规格能力;生产排程;multi-site planning;wafer probing;process capability;production scheduling |
公开日期: | 2002 |
摘要: | 配合半导体制造业之发展,企业藉由增建厂房或合并其他企业,以获得足够的产能来满足订单之需求,因此形成企业从本身的生产规划延伸到与其它企业间的协调及合作机制;同时,造成上中下游整合的趋势以完成产品制造之使命。因此本文针对晶圆制造及针测流程之生产特性,发展一生产规划模式,用以规划各阶段各厂最适宜生产之产品等级别及数量。 本文主要分为两个机制,其中“晶圆制造厂之生产规划机制”系采用赖氏[27]构建之生产规划模式。机制中根据企业所规划各产品之产出目标,考量晶圆制造厂之产能水准、各世代制程之获利能力及同产品族生产数量等限制,在符合利用率及生产周期绩效下,求算出各晶圆制造厂生产之产品别以及数量。接着,配合生产周期时间的估算,推估出各工单之可交货日程表等资讯,以利晶圆针测厂之生产规划之运作。 在“晶圆针测厂生产规划机制”下,则是汇整晶圆制造厂之生产规划机制所推得的各工单之预计可交货日、产品别及产出量等资讯,考量各针测厂可提供之产能水准、制程规格能力等限制,求算各针测厂在利用率平准化下应分担各类制程规格能力之负荷量。利用上述结果,再将待测晶圆之产品别工单指派到提供特定制程规格能力之针测厂的各工作站,使其达成负荷均衡之目标,并具市场生产周期时间之竞争力。 模拟结果显示,透过本文构建之生产规划机制,可快速获知各晶圆制造厂应生产之产品别及数量,与各针测厂应承接哪些产品别对应之工单及数量,以使各厂各工作站之利用率平准化,并具市场上生产周期时间之竞争力,而供企业管理者做为订单承接、交期设定之参考依据。 Following the development of semiconductor industry, an enterprise will establish a new factory or merge others to get enough capacity for satisfying the customers’ order needs. The production planning of an enterprise thus is extended for cooperating with others. At the same time, there is a trend to integrate the up-stream and down-stream semiconductor factories for achieving the mission of producing final products. This study will focus on wafer fabrication and probing process and will develop an efficient production planning system for planning the product type and production quantity produced at each factory in each stage. The thesis proposes two mechanisms. The first is basically applying the production planning system for the wafer fabrication by Lai [27]. With this mechanism, according to the throughput plan of the enterprise, we derive product mix at each site with the considerations of the capacity limitation of each fab site, profits of each generation in order to suit the performance of leveled utilization rate and cycle time. Next, based on the estimated cycle time, we can predict the due date of each order that is an input data for the production planning system of probing process. The production planning mechanism for the wafer probing factory aggregates planning results of wafer fabrication, such as predicted due date of each order, throughput target of each product type, capacity supply and capability constraints of every workstation. The load resulted from each capability type is allocated to each probing factory with load leveling consideration. With this result, this thesis then assign job-order of each product type to the workstation that can provide corresponding capability, in order to not only fulfill goal of leveled utilization rate but also have competitive cycle time. Simulation result shows that the proposed production planning mechanisms can quickly derive the product type and corresponding quantities that each wafer fabrication should produce. Also the allocation of job orders to wafer probing factories can achieve the goal of leveled utilization rate among workcenters in a factory and can maintain competitive production cycle time. Such results can provide information to managers about how to process order accept ion and to set due date. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#NT910031040 http://hdl.handle.net/11536/69798 |
显示于类别: | Thesis |