晶片系統溫度管理設計的多準位控制器

Abstract

在今日半導體技術的帶領下，積體電路設計已進入System-on-Chip時期，而製程技術的革新和電晶體面積的縮小，使得每個晶片有較高的電路密度和總功率消耗，由於這兩個因素，造成整個晶片溫度上升，此溫度上升的現象也影響時脈同步和其他參數的變化，這也是造成系統故障的主要原因。因此，有效管理積體電路的溫度是必要的，而溫度管理系統常使用多準位控制器來控制冷卻裝置。在本篇論文中，提出新的多準位控制器設計，並將過去溫度管理系統整合系統管理匯流排，使本篇論文的設計產生較小的面積和功率消耗。因此在本論文中，遵循SoC設計流程實現本論文提出的多準位控制器，並將溫度管理系統整合系統管理匯流排使成為軟體矽智產，因此提供System-on-Chip設計者可輕易的整合此矽智產到他們自己的設計中。

The evolution of modern semiconductor technology escorts the VLSI design into the system-on-chip era. Innovations in process technology and decreasing in transistor feature size introduce higher circuit density and total power dissipation per chip. Above two factors cause the local overheating and increase in overall temperature on a chip. These thermal phenomena cause the clock synchronization problems, parameter mismatching and other coefficient changes, which are the major reasons for system failure of on-chip circuitry. Thus, a effective thermal management for integrated circuits is necessary and a multi-level controller is often used for controlling a cooling device. In this thesis, a novel fully integratable multi-level controller is proposed, and its integration to a thermal management system with interface circuitry to modern system-on-chip platform is implemented. The proposed design yields smaller area and power dissipation comparing to other designs. The implementation of proposed multi-level controller and targeting thermal management system follows the intellectual property (IP) design guidelines for modern system-on-chip design flow. Thus, proposed multi-level controller and targeting thermal management will be encapsulated into soft-IP. The result of this project provides the system-on-chip designer a complete solution to integrate these two intellectual properties into their own designs.