微流體元件Flip-flop之研發

Abstract

近幾年來，微機電技術被廣泛的用在各個領域，如下圖[1]所示，將元件大幅縮小，不但可以節省大量成本，對一些控制系統而言，不但可以大幅提高精密度，又不會佔去太多空間，因此，論文中將一流體元件微小化,並設計實驗檢測其邏輯性,實驗結果符合,且出口壓力值約為2bar.

Over the past few years the field of MEMS (Micro Electro Mechanical System) has become well established technology. This development was advanced by the prospect of being able to produce new types of sensors and fabricate them at low cost. We use some semiconductor technology and (110) p-type Silicon wafer to minimize some fluid element. Use the characteristic of the wafer's crystal face and choose suitable etching solution (KOH) to etch the wafer, we can get the channel which is vertical to the wafer's surface. And the channel part is finished. Then, use the same etching solution to etch through wafer, we can get holes on the wafer. And the port part (input/output part) is finished. Using the bond technology to assemble wafers (channel part and port part). Then, we can get a micro fluidic logic element. In the experiment, the element (port part) link up capillaries together and connect with the suitable fluidic pressure supply. Configures these fluidic pressure supplies and signal controller and observes the logic characteristics of the micro fluidic logic element. The results of the experiment conform to the logic characteristics of the micro fluidic logic element. And the pressure of the output is about 2 bar.