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dc.contributor.authorCheng, C. F.en_US
dc.contributor.authorWu, C. H.en_US
dc.contributor.authorSu, N. C.en_US
dc.contributor.authorWang, S. J.en_US
dc.contributor.authorMcAlister, S. P.en_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:09:24Z-
dc.date.available2014-12-08T15:09:24Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-1507-6en_US
dc.identifier.urihttp://hdl.handle.net/11536/7168-
dc.identifier.urihttp://dx.doi.org/10.1109/IEDM.2007.4418939en_US
dc.description.abstractWe report very low V(t) [Ir-Hf]/HfLaO CMOS using novel self-aligned low-temperature ultra shallow junctions with gate-first process compatible with current VLSI. At 1.2 nm EOT, good phi(m-eff) of 5.3 and 4.1 eV, low V(t) of +0. 05 and 0.03 V, high mobility of 90 and 243 cm(2)/Vs, and small 85 degrees C BTI <32 mV (10 MV/cm, 1 hr) are measured for p- and n-MOS.en_US
dc.language.isoen_USen_US
dc.titleVery low V(t) [Ir-Hf]/HfLaO CMOS using novel self-aligned low temperature shallow junctionsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/IEDM.2007.4418939en_US
dc.identifier.journal2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2en_US
dc.citation.spage333en_US
dc.citation.epage336en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000259347800074-
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