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dc.contributor.authorLi, Yimingen_US
dc.contributor.authorHwang, Chih-Hongen_US
dc.contributor.authorLi, Tien-Yehen_US
dc.date.accessioned2014-12-08T15:09:31Z-
dc.date.available2014-12-08T15:09:31Z-
dc.date.issued2009-05-01en_US
dc.identifier.issn1549-7747en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCSII.2009.2019168en_US
dc.identifier.urihttp://hdl.handle.net/11536/7266-
dc.description.abstractAs the dimensions of semiconductor devices continue to be reduced, device fluctuations have become critical to determining the accuracy of timing in circuits and systems. This brief studies the discrete-dopant-induced timing characteristic fluctuations in 16-nm-gate complementary metal-oxide-semiconductor (CMOS) circuits using a 3-D "atomistic" coupled device-circuit simulation. The accuracy of the simulation has been confirmed by using the experimentally calibrated transistor physical model. For a 1.6-nm-gate CMOS inverter, 3.5%, 2.4%, 18.3%, and 13.2% normalized fluctuations in the rise time, fall time, high-to-low delay time, and low-to-high delay time, respectively, are found. Random dopants may cause significant timing fluctuations in the studied circuits. Suppression approaches that are based on the circuit and device design viewpoints are implemented to examine the associated characteristic fluctuations. The use of shunted transistors in the circuit provides similar suppression to the use of a device with doubled width. However, both approaches increase the chip area. To eliminate the need to increase the chip area, channel engineering approaches (vertical and lateral) are proposed, and their effectiveness in reducing the timing fluctuation is demonstrated.en_US
dc.language.isoen_USen_US
dc.subjectFluctuation suppression techniqueen_US
dc.subjectmodeling and simulationen_US
dc.subjectnanometer-scale metal-oxide-semiconductor field-effect transistor (MOSFET) device and circuiten_US
dc.subjectrandom dopant effecten_US
dc.subjecttiming fluctuationen_US
dc.titleDiscrete-Dopant-Induced Timing Fluctuation and Suppression in Nanoscale CMOS Circuiten_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCSII.2009.2019168en_US
dc.identifier.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFSen_US
dc.citation.volume56en_US
dc.citation.issue5en_US
dc.citation.spage379en_US
dc.citation.epage383en_US
dc.contributor.department电信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000266331400010-
dc.citation.woscount11-
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