完整後設資料紀錄
DC 欄位語言
dc.contributor.author戴興偉en_US
dc.contributor.authorTai,Hsing-Weien_US
dc.contributor.author張永佳en_US
dc.contributor.authorChang,Yung-Chiaen_US
dc.date.accessioned2014-12-12T02:39:58Z-
dc.date.available2014-12-12T02:39:58Z-
dc.date.issued2013en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT070163327en_US
dc.identifier.urihttp://hdl.handle.net/11536/74155-
dc.description.abstract每個IC(Integrated Circuit)都有個識別的方式,那就是IC的蓋印,蓋印也象徵著品牌,是一種無形的公司形象。蓋印中包含許多重要的資訊,可用來追朔產品批號、產品型號、生產工廠、生產時間等等,雖然蓋印不良不會影響產品品質與功能,但如果不清楚或者不正確就無法識別此IC的身份,當然後續也無法正確的使用。當生產線異常發生時,還可以利用蓋印的資訊追查生產的機台及設備,有效掌握異常批整個生產的程序,立即對於異常設備及機台做有效的防堵,以避免異常擴大發生,所以這對於公司而言除了避免不必要的浪費,也可以對於整個生產的掌握度更佳全面。 現在半導體產業已經進入微利時代,公司除了須要提升技術能力與製程改善,對於降低成本、減少不必要的生產報廢,也是公司努力的目標。本研究透過實驗設計法(Design Of Experiments,DOE) ,對於蓋印的製造過程中,找出造成球腳陣列封裝(Ball Grid Array,BGA)產品蓋印不良的顯著因子進行實驗,並利用變異數分析方法(Analysis Of Variance,ANOVA)分析所收集到的實驗數據,求出最佳化的製程參數值與配方,改善蓋印不良的問題。此研究成果除了改善個案公司球腳陣列封裝產品的蓋印不良問題,也可以降低不必要的報廢。zh_TW
dc.description.abstractEach IC has a recognizable way which is marking, the marking is an invisible image of the company and also is a symbol of the brand. Marking contains has many important information that can be used to traceability production identify, product model, production plants, production time, etc in batch products. Although poor marking can not affect quality and functionality of the product, but if IC has indistinct or wrong contents of marking, you do not properly identify this IC, of course, can not the correct using. When the abrupt matter occurs in the production line, you can use the information of marking to trace the machines and equipment of the production to effectively control the entire production process and immediately to make effective actions for abnormal equipment and machines, in order to avoid the abnormal expanding. So that can in addition to avoiding unnecessary waste for the company, also be overall control the production. This study used the experimental design method, finding the significant factor of Ball Grid Array products in marking process and execute experiment, using statistical analysis of variance of experimental data finding the prominent factors influence the interaction between the relationship, and find the best values of the process parameters to improve marking defect problem. This study result in addition to improve the question of the marking defect of BGA package in the case company, but also can reduce unnecessary scrap.en_US
dc.language.isozh_TWen_US
dc.subject蓋印不良zh_TW
dc.subject實驗設計zh_TW
dc.subject變異數分析zh_TW
dc.subjectMarking defecten_US
dc.subjectDOEen_US
dc.subjectANOVAen_US
dc.title利用實驗設計法改善球腳陣列封裝產品蓋印不良問題-以X公司封裝廠為例zh_TW
dc.titleUsing Design of Experiments to Improve Marking Problem of Ball Grid Array Package Type-Case Study Assembly House of X Companyen_US
dc.typeThesisen_US
dc.contributor.department管理學院工業工程與管理學程zh_TW
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