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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorHsiao, Yuan-Wenen_US
dc.date.accessioned2014-12-08T15:09:48Z-
dc.date.available2014-12-08T15:09:48Z-
dc.date.issued2009-03-01en_US
dc.identifier.issn0916-8524en_US
dc.identifier.urihttp://dx.doi.org/10.1587/transele.E92.C.341en_US
dc.identifier.urihttp://hdl.handle.net/11536/7510-
dc.description.abstractAn impedance-isolation technique is proposed tor on-chip ESD protection design tor radio-frequency (RF) integrated circuits (ICs), Which has been successfully verified in a 0.25-mu m CMOS process with thick top-layer metal. With the resonance of LC-tank at the operating frequently of the RF circuit, the impedance (especially, the parasitic capacitance) of the ESD protection devices can be isolated from the RF input node of low-noise amplifier (LNA). Therefore. the LNA can be co-designed with the proposed impedance-isolation technique to simultaneously achieve excellent RF performance and high ESD robustness. The power gain (S(21)-parameter) and noise figure of the ESD protection circuits with the proposed impedance-isolation techniques have been experimentally measured and compared, to those with the conventional double-diodes ESD Protection scheme. The proposed impedance-isolation technique had been demonstrated to he suitable for on-chip ESD protection design for RF ICs.en_US
dc.language.isoen_USen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectimpedance-isolation techniqueen_US
dc.subjectLC-tanken_US
dc.subjectnoise figure power gainen_US
dc.titleImpedance-Isolation Technique for ESD Protection Design in RF Integrated Circuitsen_US
dc.typeArticleen_US
dc.identifier.doi10.1587/transele.E92.C.341en_US
dc.identifier.journalIEICE TRANSACTIONS ON ELECTRONICSen_US
dc.citation.volumeE92Cen_US
dc.citation.issue3en_US
dc.citation.spage341en_US
dc.citation.epage351en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000265630000010-
dc.citation.woscount1-
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