标题: 氮极性独立式氮化镓基板磷酸蚀刻机制与形貌探讨
The study of morphology and etching mechanism on N-face Phosphoric acid treatment free-standing GaN
作者: 杜佳豪
Du, Jia-Hao
李威仪
Lee, Wei-I
电子物理系所
关键字: 氮化镓;极化;湿式处理;湿式蚀刻;GaN;polarization;wet treatment;wet etch
公开日期: 2014
摘要: 本论文在探讨氮极性独立式氮化镓磷酸蚀刻的形貌与机制。磷酸被被认是个很方便的酸性溶液在于检验氮化镓基板的品质,但是很少团队对于磷酸去除氧化物的能力与蚀刻机制的探讨。从镓极性独立式氮化镓基板做完XPS的结果来看,氧含量的比例相较于没做磷酸处理的样品为30-50%,且从XPS的束缚能往高能阶偏移了0.83 eV,可以知道电子浓度在做完磷酸蚀刻后增加了,合理地的就是有氮空缺的形,由此推论氢原子为磷酸蚀刻的主要反应。由拉曼量测结果与其对氢氧化钾蚀刻的比较后,确立了磷酸的蚀刻机制。藉此去看氮极性氮化镓基板的磷酸蚀刻形貌。
从结果来看,磷酸不论是在镓极性面还是氮极性面,都会从表面的缺陷开始攻击。只要是磷酸蚀刻后的形貌,必会出现镓极性的稳定面。所以在镓极性面上会出现V-pits和氮极性面上出现十二面角锥的情况,亦可以使用这个模型来解释之。
In this work, we study the morphology and etching mechanism on N-face phosphoric acid treatment free-standing GaN. It’s well known that phosphoric acid is good solution to recognize the surface defect on Ga-polar GaN, but it seldom used for removing native oxide on GaN, and discussed the etching mechanism. On XPS measurement, we found that the oxygen content on acid treatment sample was only 30-50% comparing to un-treatment sample, and the binding energy had been shifted 0.83 eV after H3PO4 treatment, it meant that the electron concentration was raised. We infer it be caused by the hydrogen atom. And that was the main reactant on H3PO4 etching. This result verified by Raman measurement and KOH etching mechanism.
Finally, we demonstrated that the pyramids appeared on N-face H3PO4 treatment samples, and v-pits formed on Ga-face by etching pits density experiment. All the facets after H3PO4 etching were Ga-polarity.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT070052054
http://hdl.handle.net/11536/76288
显示于类别:Thesis


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