标题: 半导体晶圆代工产业向前整合趋势研讨-以T公司凸块封装为例
Forward Integration Trend Research in Semiconductor Foundry Industry- Based on T-company Bumping Assembly
作者: 连仁豪
Julian Lien
李经远
Gin-Yuan Lee
管理学院管理科学学程
关键字: 晶圆代工;垂直整合;竞争优势;凸块封装;Foundry;Vertical Integration;Competitive Advantage;Bumping Assembly
公开日期: 2004
摘要: 台湾积体电路公司自1987年创立以来,建立了另一种半导体分工制造的商业模式。原本半导体公司从IC开发到最终成品测试都是一手完成的工作流程,变成上下游分工的IC设计、光罩制作、晶片制造与晶圆针测、晶片封装与测试检查等不同的产业。而台积电经过十多年的耕耘,专注于晶片制造与晶圆针测业务,已经成为晶圆代工产业的佼佼者。
随着晶圆代工产业的快速成长加上晶圆代工业者的利润颇丰,原本非经营晶圆代工的业者也开始跨入此一产业,加上中国大陆利用低廉的人力成本与广大的内陆市场作为诱因,使得中国大陆近几年来快速的成立数家半导体公司进入此一产业,面对后起之秀的竞争,身为晶圆代工产业的龙头老大台积电本身如何持续保有竞争优势,是一个经营管理者需要仔细思考、勇于面对的课题。
本研究系从产业环境与企业本身竞争优势两个层面着手,探讨个案本身的优势与劣势,再从半导体供应链的角度来探讨晶圆代工产业向前垂直整合的利基与竞争优势。论文第一章确定研究动机、目的与范围,第二章文献探讨找出研究的理论基础及分析架构,第三章简述半导体产业现况,第四章制定研究方法,第五章则利用波特五力分析来分析企业外部竞争的机会与威胁、利用Hill&Jones的竞争优势形成过程找出个案企业的内部竞争优势,再利用垂直整合分析个案企业如何持续保有竞争优势。第六章则针对前面章节的分析结果做出结论与建议。
Since Taiwan Semiconductor Manufacturing Company (TSMC) was founded at 1987, it built a new division business model in semiconductor. In the past, semiconductor production is a fully integrated process from IC design to final testing. After new business model come from TSMC, semiconductor manufacturing was split by several parts, like IC design, mask manufacturing, wafer manufacturing, assembly and final testing. During several years group up, TSMC, focus on semiconductor foundry business, is the leader in foundry industry.
With fast grow up and more benefit in semiconductor foundry, Non-foundry Company tends to join into this industry more and more. Another competitor is newcomer in mainland China. Based on China’s low manpower costs and large inner market, some semiconductor companies set up to into foundry industry in recent years. Fast to newcomer’s competition, how to keep the competitive advantage are the important things in TSMC, the leader in semiconductor foundry industry.
The thesis is studying the competitive advantage of TSMC based on industry environment and company’s strategy. Thr first chapter outlines the study motivation, objective and scope. Chapter 2 develops the theory foundation and analysis model drived from the lecture study. Chapter 3 describes the current semiconductor industry status. Chapter 4 defines the study method. Chapter 5 uses Michael E. Porter five forces model to analyze the external opportunity and threat to TSMC and uses Hill & Jones’ “The Roots of Competitive Advantage” to figure out TSMC’s internal competitive advantage. Then, we use vertical integration method to analyze that how to keep competitive advantage in TSMC. The chapter 6 provides summary and suggestion.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT009262537
http://hdl.handle.net/11536/77586
显示于类别:Thesis


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