Title: Routing for Manufacturability and Reliability
Authors: Chen, Huang-Yu
Chang, Yao-Wen
交大名義發表
National Chiao Tung University
Issue Date: 2009
Abstract: As IC process geometries scale down to the nanometer territory, industry faces severe challenges of manufacturing limitations. To guarantee high yield and reliability, routing for manufacturability and reliability has played a pivotal role in resolution and thus yield enhancement for the imperfect manufacturing process. In this article, we introduce major routing challenges arising from nanometer process, survey key existing techniques for handling the challenges, and provide some future research directions in routing for manufacturability and reliability.
URI: http://hdl.handle.net/11536/7763
http://dx.doi.org/10.1109/MCAS.2009.933855
ISSN: 1531-636X
DOI: 10.1109/MCAS.2009.933855
Journal: IEEE CIRCUITS AND SYSTEMS MAGAZINE
Volume: 9
Issue: 3
Begin Page: 20
End Page: 31
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