标题: Routing for Manufacturability and Reliability
作者: Chen, Huang-Yu
Chang, Yao-Wen
交大名義發表
National Chiao Tung University
公开日期: 2009
摘要: As IC process geometries scale down to the nanometer territory, industry faces severe challenges of manufacturing limitations. To guarantee high yield and reliability, routing for manufacturability and reliability has played a pivotal role in resolution and thus yield enhancement for the imperfect manufacturing process. In this article, we introduce major routing challenges arising from nanometer process, survey key existing techniques for handling the challenges, and provide some future research directions in routing for manufacturability and reliability.
URI: http://hdl.handle.net/11536/7763
http://dx.doi.org/10.1109/MCAS.2009.933855
ISSN: 1531-636X
DOI: 10.1109/MCAS.2009.933855
期刊: IEEE CIRCUITS AND SYSTEMS MAGAZINE
Volume: 9
Issue: 3
起始页: 20
结束页: 31
显示于类别:Articles


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