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dc.contributor.authorWang, D. P.en_US
dc.contributor.authorLia, H. J.en_US
dc.contributor.authorYamauchi, H.en_US
dc.contributor.authorChen, Y. H.en_US
dc.contributor.authorLin, Y. L.en_US
dc.contributor.authorLin, S. H.en_US
dc.contributor.authorLiu, D. C.en_US
dc.contributor.authorChang, H. C.en_US
dc.contributor.authorHwang, W.en_US
dc.date.accessioned2014-12-08T15:10:10Z-
dc.date.available2014-12-08T15:10:10Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-1592-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/7767-
dc.identifier.urihttp://dx.doi.org/10.1109/SOCC.2007.4545460en_US
dc.description.abstractThis paper presents circuit techniques to improve write and read capability for dual-port SRAM design fabricated in a 45nm low-power process. The write capability is enhanced by negative write biasing without any reduction in the cell current for the other port. The result shows 12% better improvement with just 1.9% area overhead. This technique has been verified successfully on 65nm and 45nm SRAM chip and improved 120mV lower at 95% yield of minimum operation voltage than a conventional one. The read capability is enhanced by cell current boosting and word line voltage lowering schemes. The SNM is also enhanced significantly. The target is to work below 0.8V with the worst process corner variation.en_US
dc.language.isoen_USen_US
dc.titleA 45nm dual-port SRAM with write and read capability enhancement at low voltageen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/SOCC.2007.4545460en_US
dc.identifier.journal20TH ANNIVERSARY IEEE INTERNATIONAL SOC CONFERENCE, PROCEEDINGSen_US
dc.citation.spage211en_US
dc.citation.epage214en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000257572200048-
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