完整後設資料紀錄
DC 欄位語言
dc.contributor.author邱垂昌en_US
dc.contributor.authorCHIU CHUI-CHANGen_US
dc.contributor.author周長彬en_US
dc.contributor.authorCHOU CHANG-PINen_US
dc.date.accessioned2014-12-12T02:50:41Z-
dc.date.available2014-12-12T02:50:41Z-
dc.date.issued2005en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT009269501en_US
dc.identifier.urihttp://hdl.handle.net/11536/77806-
dc.description.abstract摘要       高熵合金為近年國內自行開發出來的新材料,運用多種金屬元素共同組成,每種元素至多不超過35 %,經各種元素排列組合後,可組合成許多種新合金,較傳統合金更耐蝕、更耐高溫、硬度高且不易氧化。 本研究中以BAg-2及BAg-3二種銀基硬銲填料,於真空爐中進行高熵合金硬銲性能研究,研究結果顯示,FeCoNiCrCuAl0.5高熵合金鑄件為FCC相及微量的BCC相所組成,樹枝間相為富Cu的偏析相,經硬銲熱循環750℃持溫15分鐘熱處理後,BCC相之繞射強度明顯較鑄造態增強,顯示基地有更多之BCC相被析出。FeCoNi0.5CrAl0.5高熵合金鑄件結構由FCC相及BCC相所組成,主因為合金成份中缺少FCC相的促進元素Cu,與減半的Ni元素,故在凝固過程較易形成BCC相。以BAg-2銀基填料真空硬銲FeCoNiCrCuAl0.5及FeCoNi0.5CrAl0.5高熵合金,接合區域均無界面化合物產生;而以BAg-3銀基填料進行真空硬銲,高熵合金母材成份元素中Fe、Ni、Cr、Co在硬銲接合過程中熔入接合區域之交界處中。 關鍵字:高熵合金、硬銲、偏析相zh_TW
dc.description.abstractABSTRACT The development of high-entropy alloys has aroused considerable interest recently. These newly developed alloys have good corrosion and wear resistance , high temperature mechanical proerities , and special physical and chemical properties . The objective of this study was to investigate the properties of two high-entropy alloys , FeCoNiCuAl0.5 and FeCoNi0.5CrAl0.5 , and their brazing ability with filler metals BAg-2 and BAg-3 . The vacuum brazing process was used .Optical metallography and SEM+EDAX analysis were conducted to investigate the microstructure analysis and element distribution . The results of this study shown as follows: The microstructure of FeCoNiCuAl0.5 high entropy alloy casting showed that the matrix consists of a FCC phase with a small amount of BCC phase on it, and the interdendritic segregation was specified as a copper rich phase. The microstructure of FeCoNi0.5CrAl0.5 high entropy alloy consisted of FCC phase and BCC phase. Using silver based BAg-2 as a vacuum hard solder for FeCoNiCrCuAl0.5 and FeCoNi0.5CrAl0.5 high entropy alloys, no interface compound formed at joint area. However, when using BAg-3 as the hard solder, it was found that the constituent elements of the matrix, such as Fe, Ni, Cr and Co dissolved into the interface during the joint process.en_US
dc.language.isozh_TWen_US
dc.subject高熵合金zh_TW
dc.subject硬銲zh_TW
dc.subjectHIGH ENTROPY ALLOYSen_US
dc.subjectBRAZINGen_US
dc.title銀基填料對高熵合金真空硬銲特性之研究zh_TW
dc.titleThe Vacuum Brazing Characteristics of High entropy Alloys using Silver-Based Filler Metalsen_US
dc.typeThesisen_US
dc.contributor.department工學院精密與自動化工程學程zh_TW
顯示於類別:畢業論文


文件中的檔案:

  1. 950101.pdf
  2. 950102.pdf
  3. 950103.pdf
  4. 950104.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。