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dc.contributor.authorLo, H. C.en_US
dc.contributor.authorLuo, W. C.en_US
dc.contributor.authorLu, W. Y.en_US
dc.contributor.authorCheng, C. F.en_US
dc.contributor.authorChen, T. L.en_US
dc.contributor.authorLien, C. H.en_US
dc.contributor.authorFung, S. K. H.en_US
dc.contributor.authorWu, C. C.en_US
dc.date.accessioned2014-12-08T15:10:19Z-
dc.date.available2014-12-08T15:10:19Z-
dc.date.issued2009en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/7887-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3223971en_US
dc.description.abstractBody-to-body leakage (BBL) current in a partially depleted silicon-on-insulator (PD-SOI) device is increased significantly as polyspacing (PS) is reduced in technology scaling. We found out that the BBL has a great impact to Vt variation. We have demonstrated that the BBL can be minimized drastically by implant optimization. The dependence of the BBL on silicon film thickness, e-SiGe structure, and dopant diffusivity is also discussed in this paper. The layout effect of the BBL current in PD-SOI devices has been characterized with different PSs, device widths, and polylengths. Finally, we have demonstrated that the BBL current can be reduced below junction leakage level. (C) 2009 The Electrochemical Society. [DOI:10.1149/1.3223971] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleThe Characteristics and Control of Body-to-Body Leakage Current in PD-SOIen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.3223971en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume156en_US
dc.citation.issue11en_US
dc.citation.spageH841en_US
dc.citation.epageH845en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000270457600065-
dc.citation.woscount0-
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