Title: Output Power Enhancement of Vertical-Injection Ultraviolet Light-Emitting Diodes by GaN-Free and Surface Roughness Structures
Authors: Lee, C. E.
Cheng, B. S.
Lee, Y. C.
Kuo, H. C.
Lu, T. C.
Wang, S. C.
光電工程學系
Department of Photonics
Keywords: laser materials processing;light emitting diodes;surface roughness;wafer bonding
Issue Date: 2009
Abstract: Nitride-based UV, vertical-injection light-emitting diodes (VLEDs) with GaN-free and surface roughness structures operating at 365 nm were proposed and demonstrated by a combination of wafer bonding and laser lift-off processes. The GaN-free structure offers a promising potential for enhancing the light output of UV-VLEDs. The 3.2x light output enhancement was performed by removing the GaN. With the help of adopting a roughened surface, the light-output power of the UV-VLEDs could be further enhanced by a factor of 2.3 as compared with that of UV-VLED without a roughened surface. The total enhancement of surface-roughened GaN-free UV-VLEDs was increased by a factor of 7.8 compared to that of conventional UV-LEDs at a driving current injection of 250 mA.
URI: http://hdl.handle.net/11536/7910
http://dx.doi.org/10.1149/1.3046003
ISSN: 1099-0062
DOI: 10.1149/1.3046003
Journal: ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume: 12
Issue: 2
Begin Page: H44
End Page: H46
Appears in Collections:Articles