熱應力對裂縫平板影響之特性分析

Abstract

隨著21世紀消費市場的需求，科技產品講究輕、薄、短、小、高精密產品，須增加組裝密度，然而所產生的熱傳問題卻很嚴重。在BGA的封裝型式開始發展，由於面陣列的方式可容納更多的錫球作為I/O，而相對的機板的I/O線路也越來越小，產生的熱傳問題也較以往更為嚴重。然而“熱”一直是造成PCB板及電子元件失效的最主要原因，這是因為不同的電子元件材料內部熱膨脹係數不一致以及構裝體系統內部熱源所產生的熱應力；這些熱應力會導致基材及電子元件鑲接處產生微小裂縫進而產生破壞。 本文的目的在利用COSMOS分析軟體研究熱應力對裂縫影響的特性分析。因而此部份的應力與應變就顯得格外重要，分析熱應力、熱源位置與裂縫較具影響力的參數加以整合分析。藉以預防產品構裝過程中因為熱應力及溫度循環的負載所產生的諸多問題，提高產品的良率及可靠度。

To follow 21 century consumer market require，technology product more and more are stressing light、thin、short、small、high precision，however mobile phone、notebook、blue-tooth、digital camera、wireless module etc，have to combine every functional all in one。So can achieve high precision laser process become indispensable technology。

However heat always to cause PCB (Printer Circuit Board) and electrical component to lose efficacy main reason。This is different electronic component internal temperature not accord and package internal heat source to produce thermal stress，these thermal stress could cause substrate to emerge crack and cause destroy。

This paper purpose is use COSMOS analysis software to research thermal stress influence crack growth characteristic and analysis material crack growth forecast model。In package or system internal，integration thermal stress、thermal strain、and crack influence parameter and then analysis。As well to protect product in package process because to heat influence many problem，promote product yield and reliability。