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dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorLin, S. H.en_US
dc.contributor.authorJhou, K. Y.en_US
dc.contributor.authorChen, W. J.en_US
dc.contributor.authorChou, C. P.en_US
dc.contributor.authorYeh, F. S.en_US
dc.contributor.authorHu, J.en_US
dc.contributor.authorHwang, M.en_US
dc.contributor.authorArikado, T.en_US
dc.contributor.authorMcAlister, S. P.en_US
dc.date.accessioned2014-12-08T15:11:06Z-
dc.date.available2014-12-08T15:11:06Z-
dc.date.issued2008-08-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2008.2000833en_US
dc.identifier.urihttp://hdl.handle.net/11536/8516-
dc.description.abstractWe report Ir/TiO(2)/TaN metal-insulator-metal capacitors processed at only 300 degrees C, which show a capacitance density of 28 fF/mu m(2) and a leakage current of 3 x 10(-8) (25 degrees C) or 6 x 10(-7) (125 degrees C) A/cm(2) at -1 V. This performance is due to the combined effects of 300 degrees C nanocrystallized high-kappa, TiO(2), a high conduction band offset, and high work-function upper electrode. These devices show potential for integration in future very-large-scale-integration technologies.en_US
dc.language.isoen_USen_US
dc.subjecthigh kappaen_US
dc.subjectIren_US
dc.subjectmetal-insulator-metal (MIM)en_US
dc.subjectTiO(2)en_US
dc.titleHigh density and low leakage current in TiO(2) MIM capacitors processed at 300 degrees Cen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2008.2000833en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume29en_US
dc.citation.issue8en_US
dc.citation.spage845en_US
dc.citation.epage847en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000258096000008-
dc.citation.woscount37-
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