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dc.contributor.authorChung, Shu-Hsingen_US
dc.contributor.authorLee, Amy Hsin-Ien_US
dc.contributor.authorKang, He-Yauen_US
dc.contributor.authorLai, Chih-Weien_US
dc.date.accessioned2014-12-08T15:11:15Z-
dc.date.available2014-12-08T15:11:15Z-
dc.date.issued2008-07-01en_US
dc.identifier.issn0957-4174en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.eswa.2007.07.011en_US
dc.identifier.urihttp://hdl.handle.net/11536/8631-
dc.description.abstractIn a competitive market, semiconductor fabricator must face an environment with multi-product types, multi-priority orders and demand changes in time. Since semiconductor fabrication has a very complicated production process, the above-stated characteristics make the production planning even more difficult. This paper applies data envelopment analysis (DEA) to find a set of product family mix that is efficient for the company to produce. To ensure long-term effectiveness in productivity and in profit gaining, window analysis is adopted to seek the most recommended set of product family mixes for manufacturing by measuring the performance changes over time. With this method, the performance of a mix in one period is compared not only with the performance of other mixes but also with its own performance in other periods. The proposed mechanism can provide guidance to the fabricator regarding strategies for aggregate planning so as to improve manufacturing efficiency. (c) 2007 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectdata envelopment analysisen_US
dc.subjectDEAen_US
dc.subjectproduct family mixen_US
dc.subjectwindow analysisen_US
dc.titleA DEA window analysis on the product family mix selection for a semiconductor fabricatoren_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.eswa.2007.07.011en_US
dc.identifier.journalEXPERT SYSTEMS WITH APPLICATIONSen_US
dc.citation.volume35en_US
dc.citation.issue1-2en_US
dc.citation.spage379en_US
dc.citation.epage388en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000257617100038-
dc.citation.woscount8-
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