覆晶銲錫接點電遷移孔洞生成機制之研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	陳智	en_US
dc.contributor.author	Chen Chih	en_US
dc.date.accessioned	2014-12-13T10:29:25Z	-
dc.date.available	2014-12-13T10:29:25Z	-
dc.date.issued	2006	en_US
dc.identifier.govdoc	NSC95-2218-E009-022	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/89262	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=1192378&docId=225645	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	覆晶銲錫接點電遷移孔洞生成機制之研究	zh_TW
dc.title	Mechanisms of Void Formation of Flip-Chip Solder Joints during Electromigration	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學材料科學與工程系	zh_TW
Appears in Collections:	Research Plans