半導體廠自動化設備控制界面程式模組化建構之研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	彭德保	en_US
dc.contributor.author	PERNG DER-BAAU	en_US
dc.date.accessioned	2014-12-13T10:29:27Z	-
dc.date.available	2014-12-13T10:29:27Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2212-E009-028	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/89311	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=513735&docId=93107	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	自動化設備控制界面程式	zh_TW
dc.subject	模組化	zh_TW
dc.subject	結構化方法	zh_TW
dc.subject	Automatic equipment control interface	en_US
dc.subject	Modularized	en_US
dc.subject	Structured methodology	en_US
dc.title	半導體廠自動化設備控制界面程式模組化建構之研究	zh_TW
dc.title	The Construction of a Modularized Machine and Monitoring Emulater for a Wafer Fab	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學工業工程與管理系	zh_TW
Appears in Collections:	Research Plans

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