完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.author | 李育民 | en_US |
| dc.contributor.author | LEE YU-MIN | en_US |
| dc.date.accessioned | 2014-12-13T10:29:31Z | - |
| dc.date.available | 2014-12-13T10:29:31Z | - |
| dc.date.issued | 2006 | en_US |
| dc.identifier.govdoc | NSC95-2220-E009-020 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/89356 | - |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1279623&docId=234489 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 單晶片系統驗證之核心技術開發---子計畫六：針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(II) | zh_TW |
| dc.title | Compact Thermal Modeling and Efficient Thermal Simulation for Hot Spots Verifications of Modern IC Designs(II) | en_US |
| dc.type | Plan | en_US |
| dc.contributor.department | 交通大學電信工程系 | zh_TW |
| 顯示於類別： | 研究計畫 | |
Loading...