Title: | 60GHZ傳送接收器之覆晶多晶片模組構裝技術與設備開發 |
Authors: | 成維華 CHIENG WEI-HUA 國立交通大學機械工程學系(所) |
Issue Date: | 2006 |
Gov't Doc #: | NSC95-2623-7009-013 |
URI: | http://hdl.handle.net/11536/89636 https://www.grb.gov.tw/search/planDetail?id=1335931&docId=247738 |
Appears in Collections: | Research Plans |