錫鉛銲錫合金的電子飄移研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	陳智	en_US
dc.contributor.author	Chen Chih	en_US
dc.date.accessioned	2014-12-13T10:29:55Z	-
dc.date.available	2014-12-13T10:29:55Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2218-E009-109	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/89797	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=619832&docId=115467	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	電子遷移	zh_TW
dc.subject	錫鉛銲錫合金	zh_TW
dc.subject	材料性質	zh_TW
dc.subject	Electromigration	en_US
dc.subject	Sn-Pb solder alloy	en_US
dc.subject	Material property	en_US
dc.title	錫鉛銲錫合金的電子飄移研究	zh_TW
dc.title	A Systematic Study of Electromigration in Sn-Pb Solder Alloys	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學材料科學與工程學系	zh_TW
Appears in Collections:	Research Plans

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