以自組裝奈米孔洞SiO/sub 2/作為次70 nm IC技術之超低介電薄膜之應用研究(III)

標題:	以自組裝奈米孔洞SiO/sub 2/作為次70 nm IC技術之超低介電薄膜之應用研究(III) Self-Assembly Nanoporous Silica as an Ultra-Low K Dielectric for Sub-70 nm IC Technologies(III)
作者:	潘扶民 PAN FU-MING 交通大學材料科學與工程系
公開日期:	2005
官方說明文件#:	NSC94-2215-E009-007
URI:	http://hdl.handle.net/11536/90332 https://www.grb.gov.tw/search/planDetail?id=1143844&docId=219366
Appears in Collections:	Research Plans

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