Full metadata record
DC FieldValueLanguage
dc.contributor.author郭建男en_US
dc.contributor.authorKUO CHIEN-NANen_US
dc.date.accessioned2014-12-13T10:31:27Z-
dc.date.available2014-12-13T10:31:27Z-
dc.date.issued2004en_US
dc.identifier.govdocNSC93-2220-E009-003zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/90948-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=1030876&docId=196408en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.title用於寬頻通信之高性能單一載具整合晶片系統-子計畫二:應用系統構裝技術之多頻射頻前端積體電路(II)zh_TW
dc.titleMulti-Band RF Front-End Integrated Circuits in System-on-Package Technology(II)en_US
dc.typePlanen_US
dc.contributor.department交通大學電子工程系zh_TW
Appears in Collections:Research Plans