| 標題: | 高性能混和訊號式介面積體電路-子計畫三：5 GHz高性能無線通訊系統中主要積體電路的設計與整合(III) The Design and Integration of Key Component ICs for 5 GHz High Performance Wireless Communication System(III) |
| 作者: | 吳重雨 CHUNG-YUWU 交通大學電子工程系 |
| 公開日期: | 2004 |
| 官方說明文件#: | NSC93-2215-E009-017 |
| URI: | http://hdl.handle.net/11536/91091 https://www.grb.gov.tw/search/planDetail?id=1026651&docId=195167 |
| Appears in Collections: | Research Plans |
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