晶圓封裝打線製程之電腦視覺檢測與品質管制研究(I)

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DC Field	Value	Language
dc.contributor.author	彭德保	en_US
dc.contributor.author	PERNG DER-BAAU	en_US
dc.date.accessioned	2014-12-13T10:33:02Z	-
dc.date.available	2014-12-13T10:33:02Z	-
dc.date.issued	2003	en_US
dc.identifier.govdoc	NSC92-2213-E009-103	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/91839	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=843508&docId=159796	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	晶圓封裝打線製程之電腦視覺檢測與品質管制研究(I)	zh_TW
dc.title	Vision Inspection and SPC Study for Wafer Wire-Bond Packaging (I)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學工業工程與管理學系	zh_TW
Appears in Collections:	Research Plans

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