微型模穴填充過程之輸送現象研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	林振德	en_US
dc.contributor.author	LIN JENN-DER	en_US
dc.date.accessioned	2014-12-13T10:33:52Z	-
dc.date.available	2014-12-13T10:33:52Z	-
dc.date.issued	2003	en_US
dc.identifier.govdoc	NSC92-2212-E009-015	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/92333	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=842542&docId=159534	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	微型模穴填充過程之輸送現象研究	zh_TW
dc.title	Study on Transport Process of Micro Injection Mold-Filling Using MEMS Fabricated Silicon Mold	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學機械工程學系	zh_TW
Appears in Collections:	Research Plans

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