標題: | 高性能混和訊號式介面積體電路---子計劃III:5 GHz高性能無線通訊系統中主要積體電路的設計與整合(I) The Design and Integration of Key Component ICs for 5 GHz High Performance Wireless Communication System(I) |
作者: | 吳重雨 CHUNG-YUWU 交通大學電子工程系 |
公開日期: | 2002 |
官方說明文件#: | NSC91-2215-E009-080 |
URI: | http://hdl.handle.net/11536/92887 https://www.grb.gov.tw/search/planDetail?id=784532&docId=150805 |
Appears in Collections: | Research Plans |
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