標題: 12吋矽晶圓半導體CVD製程設備及BST介電薄膜成長研究---子計畫II:BST 介電薄膜在12吋矽晶圓上快速熱回火製程中熱物理性質及熱應力之研究(III)
Study on the Thermal Properties and Stresses of a 12-Inches Silicon Wafer with High-Dielectric BST Thin Films in Rapid Thermal Processing/Annealing(III)
作者: 曲新生
CHU, HSIN-SEN
交通大學機械工程研究所
公開日期: 2002
官方說明文件#: NSC91-2212-E009-040
URI: http://hdl.handle.net/11536/93005
https://www.grb.gov.tw/search/planDetail?id=783005&docId=150398
Appears in Collections:Research Plans


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