銅導線及其障礙層之材質研究(II)

Full metadata record

DC Field	Value	Language
dc.contributor.author	張立	en_US
dc.contributor.author	CHANG LI	en_US
dc.date.accessioned	2014-12-13T10:36:03Z	-
dc.date.available	2014-12-13T10:36:03Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2218-E009-068	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/93730	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=597337&docId=112563	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	銅導線及其障礙層之材質研究(II)	zh_TW
dc.title	Microstructural Study of Copper Interconnect and Diffusion Barriers(II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學材料科學工程研究所	zh_TW
Appears in Collections:	Research Plans

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