線性CMP製程與實驗機台研究---子計畫VII：CMP之化學反應機制研究(I)

標題:	線性CMP製程與實驗機台研究---子計畫VII：CMP之化學反應機制研究(I) Study of Chemical Reactions on CMP(I)
作者:	蔡明蒔國立交通大學毫微米實驗室
關鍵字:	化學機械研磨;金屬連線;研磨漿料;磨除率;金屬研磨;Chemical mechanical polishing (CMP);Metal interconnection;Slurry;Removal rate;Metal polishing
公開日期:	1999
官方說明文件#:	NSC88-2212-E317-001
URI:	http://hdl.handle.net/11536/94238 https://www.grb.gov.tw/search/planDetail?id=418254&docId=74201
Appears in Collections:	Research Plans

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.