高密度電子構裝接合與測試載具之開發---子計畫II：銅接合可靠度提升之研究(III)

Title:	高密度電子構裝接合與測試載具之開發---子計畫II：銅接合可靠度提升之研究(III) Enhanced Cu Interconnection Reliability (III)
Authors:	邱碧秀 CHIOU BI-SHIOU 交通大學電子工程系
Keywords:	銅金屬化;擴散阻礙層;電子構裝;電致遷移;應力遷移;Cu metallization;Diffusion barrier layer;Electronic packaging;Electromigration;Stress migration
Issue Date:	1999
Gov't Doc #:	NSC88-2216-E009-012
URI:	http://hdl.handle.net/11536/94335 https://www.grb.gov.tw/search/planDetail?id=418199&docId=74188
Appears in Collections:	Research Plans