鋁栓塞製程於深次微米元件之應用研究(II)

Title:	鋁栓塞製程於深次微米元件之應用研究(II) Applications of Al Plug for Deep Sub-Micron Devices (II)
Authors:	吳文發國立交通大學毫微米實驗室
Keywords:	深次微米;鋁栓;多層互連;平坦化;擴散障礙層;電漿處理;接觸電阻;鋁濺鍍;Deep submicrometer;Al plug;Multilevel interconnect;Planarization;Diffusion barrier;Plasma treatment;Contact resistance;Al sputtering
Issue Date:	1999
Gov't Doc #:	NSC88-2215-E317-001
URI:	http://hdl.handle.net/11536/94382 https://www.grb.gov.tw/search/planDetail?id=428974&docId=76776
Appears in Collections:	Research Plans

APA	吳. (1999). 鋁栓塞製程於深次微米元件之應用研究(II). https://www.grb.gov.tw/search/planDetail?id=428974&docId=76776.
Bibtex	@article{1999, title={鋁栓塞製程於深次微米元件之應用研究(II)}, author={吳文發}, journal={https://www.grb.gov.tw/search/planDetail?id=428974&docId=76776}, year={1999}, url={https://ir.lib.nycu.edu.tw/handle/11536/94382}, }