| 標題: | 8吋矽晶圓半導體LPCVD製程設備之研發---子計畫II：LPCVD製程設備中加熱系統之熱輻射量測及晶圓熱應力分析(III) Study on the Heating System of LPCVD Process Equipment and Thermal Stress of Wafer (III) |
| 作者: | 曲新生 CHU, HSIN-SEN 交通大學機械工程研究所 |
| 關鍵字: | 低壓化學氣相沈積法;晶圓;熱應力;快速熱處理;熱輻射;LPCVD;Wafer;Thermal stress;Rapid thermal process (RTP);Thermal radiation |
| 公開日期: | 1999 |
| 官方說明文件#: | NSC88-2218-E009-003 |
| URI: | http://hdl.handle.net/11536/94471 https://www.grb.gov.tw/search/planDetail?id=428997&docId=76781 |
| Appears in Collections: | Research Plans |
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